JPH0469414B2 - - Google Patents

Info

Publication number
JPH0469414B2
JPH0469414B2 JP1325184A JP1325184A JPH0469414B2 JP H0469414 B2 JPH0469414 B2 JP H0469414B2 JP 1325184 A JP1325184 A JP 1325184A JP 1325184 A JP1325184 A JP 1325184A JP H0469414 B2 JPH0469414 B2 JP H0469414B2
Authority
JP
Japan
Prior art keywords
electrode
bias
plasma
high frequency
microwave
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1325184A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60158629A (ja
Inventor
Noriaki Yamamoto
Fumio Shibata
Norio Kanai
Sadayuki Okudaira
Shigeru Nishimatsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1325184A priority Critical patent/JPS60158629A/ja
Publication of JPS60158629A publication Critical patent/JPS60158629A/ja
Publication of JPH0469414B2 publication Critical patent/JPH0469414B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
JP1325184A 1984-01-30 1984-01-30 マイクロ波プラズマ処理装置 Granted JPS60158629A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1325184A JPS60158629A (ja) 1984-01-30 1984-01-30 マイクロ波プラズマ処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1325184A JPS60158629A (ja) 1984-01-30 1984-01-30 マイクロ波プラズマ処理装置

Publications (2)

Publication Number Publication Date
JPS60158629A JPS60158629A (ja) 1985-08-20
JPH0469414B2 true JPH0469414B2 (en]) 1992-11-06

Family

ID=11827987

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1325184A Granted JPS60158629A (ja) 1984-01-30 1984-01-30 マイクロ波プラズマ処理装置

Country Status (1)

Country Link
JP (1) JPS60158629A (en])

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2680065B2 (ja) * 1988-09-22 1997-11-19 株式会社日立製作所 プラズマクリーニング方法
JP3542514B2 (ja) * 1999-01-19 2004-07-14 株式会社日立製作所 ドライエッチング装置

Also Published As

Publication number Publication date
JPS60158629A (ja) 1985-08-20

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